Table of Contents

Chapter 1. Overview of High Temperature Electronics Chapter 2. Selection and Use of Silicon Devices at High Temperatures. Chapter 3. Wide Bandgap Semiconductors. Chapter 4. Passive Device Selection and Use at High Temperature. Chapter 5. First-level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 6. Second and Third Level Packaging Considerations for the Use of Electronic Hardware at High Temperatures. Chapter 7. Thermal Management Considerations for Elevated Temperature Chapter 8. Applications. Chapter 9. Accelerated Testing of Elevated Temperature Electronics. References. Index

About the Author

McCluskey, F. Patrick; Podlesak, Thomas; Grzybowski, Richard