Table of Contents

Design for Reliability Concepts.

Starting the Design Process.

Substrates.

Wire and Wirebonds.

Tape Automated Bonding.

Flip-Chip Bonding.

Attachment.

Case.

Leads.

Lead Seals.

Lid Seal and Lid.

Index.

About the Author

DR. MICHAEL G. PECHT is a tenured faculty member with a joint appointment in Systems Research and Mechanical Engineering, and the Director of the CALCE Electronic Packaging Research Center at the University of Maryland. He has an MS in electrical engineering and an MS and PhD in engineering mechanics from the University of Wisconsin. He is a Professional Engineer and an IEEE Fellow. He serves on the board of advisors for various companies and was a West-inghouse Professor. He is the chief editor of the IEEE Transactions on Reliability, and a section editor for the Society of Automotive Engineering.