These proceedings, a result of the U.S. army's commitment to improving the quality and reliability of adhesively bonded structures in present and future systems, will serve as a reference in the field of adhesion. The contributors emphasize, in the short term, root cause analysis of bond failures and the development of remedies for bond failure in equipment, in production and in the field. In the long term, the emphasis is on ensuring that adequate technology is available for the adhesive bonding of emerging materials, such as thermoplastic matrix composites, that will be appearing in future-generation equipment, and on the development of detailed models of bonded structures in order to describe the entire life cycle of a bond from its initial design to in-service deterioration. This work is an information source for all researchers involved with new materials and adhesive bonding.
These proceedings, a result of the U.S. army's commitment to improving the quality and reliability of adhesively bonded structures in present and future systems, will serve as a reference in the field of adhesion. The contributors emphasize, in the short term, root cause analysis of bond failures and the development of remedies for bond failure in equipment, in production and in the field. In the long term, the emphasis is on ensuring that adequate technology is available for the adhesive bonding of emerging materials, such as thermoplastic matrix composites, that will be appearing in future-generation equipment, and on the development of detailed models of bonded structures in order to describe the entire life cycle of a bond from its initial design to in-service deterioration. This work is an information source for all researchers involved with new materials and adhesive bonding.
Modification of free volume in epoxy adhesive formulations, Andrew Garton et al; molecular structure of polymer-metal interphases, D.J.Ondrus et al; photoacoustic FT-IR analysis of surfacce modified Kevlar 49 fibers, S.L.Tidrick and J.L.Koenig; durability of adhesion between metals and polymers, Walter Brockmann; effects of microwave processing on fiber-matrix adhesion in composites, Raj K.Agrawal and Lawrence T.Drzal; surface preparation of Ti-6Ai-4V for high temperature adhesive bonding, H.M.Clearfield et al; regeneration of adhesive bonding in fiber-resin systems, Bernard Miller and Umesh Gaur; a water soluble hydrated metal oxide primer for adhesively bonded joints, R.A.Pike and G.S.Golden; a review of certain recent work on the durability of aluminium alloy bonded with epoxide and phenolic adhesives, John Comyn; internal stresses adjacent to a hole through a multilayer wiring board, K.H.G.Ashbee and D.A.Tossell; osmosis and the kinetics of percolation of petroleum products through an epoxy adhesive, K.H.G.Ashbee and J.P.Sargent; asymptotic fields in adhesive fracture, Roshdy S.Barsoum; on the uniformity of stresses in some adhesive deformation specimens, K.M.Liechti and T.Hayashi; the adhesive fracture energy of bonded thermoplastic fibre-composites; G.K.A.Kodokian and A.J.Kinloch; application of the island blister test for thin film adhesion measurement, Mark G.Allen and Stephen D.Senturia; the effects of cure conditions on the relaxation behaviour of thermosetting adhesives, Hooshang Jozavi and Erol Sancaktar; a preliminary study of the use of Kynar piezoelectric film to measure peel stresses in adhesive joints, D.A.Dillard et al; ultrasonic evaluation of adhesive bonding, Y.Bar-Cohen et al; durability of adhesive bonds to zinc-coated steels - effects of corrosive environments on lap shear strength, J.W.Holubka et al; flexible backbone aromatic polymide adhesives, Donald J.Progar and Terry L.St.Clair; plasma treatment for improved bondings - a review, Edward M.Liston; strength predictions for lap joints, especially with composite adherends, a review, Robert D.Adams; recent advances in the application of leaky lamb waves to the nondestructive evaluation of adhesive bonds, Cecil M.Teller et al.
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